产品主要以高端双面、多层、柔性、高频、HDI任意互连、金属基、高导热金属基、陶瓷、砍入式金属基、埋容、埋磁、埋铜、凹凸台阶基板、5G高速板、厚铜、厚金、高碳阻、双面多层MiNiLED、MiNiHDILED、MiNiOLED、IC载基板、卷对卷FPC、超长FPC、超大尺寸印制电路板，特殊材料印制电路板等一体化OEM及ODM生产工厂。

　　产品广泛应用:

　　通讯设备、通讯仪器、通讯机站、LED、智能系统、智能设备、新能源、医疗器械、检测系统、检测仪器、工业功控、工业互连、5G产品、电力设备、电力系统、航空航天、军工电子、重工业设备、汽车、影视、安防、驱动设备等高端产品领域。

The products primarily include high-end double-sided, multilayer, flexible, high-frequency, HDI arbitrary interconnect, metal-based, high thermal conductivity metal-based, ceramic, embedded metal-based, buried capacitor, buried magnet, buried copper, stepped substrate, 5G high-speed board, thick copper, thick gold, high carbon resistance, double-sided multilayer MiNiLED, MiNiHDILED, MiNiOLED, IC carrier substrate, roll-to-roll FPC, ultra-long FPC, ultra-large-sized printed circuit board, and special material printed circuit board, among others, as an integrated OEM and ODM manufacturing facility.