详细说明
产品介绍DESION
DP-P2000是一款高导热率且质软型缝隙填充导热垫片,由于其较软的硬度,使其可在低压力的情况下表现出较小的热阻,同时排除元器件和电路板之间的空气,并且充分填充各类粗糙的表面。
操作简便,可重复利用。
DP-P2000 is a compliant thermal gap filler designed to provide moderate thermal performance.The pad is low thermal resistance at very low pressures, and allows the pad to fill in air voids and air gaps between PC boards and heat sinks or metal chassis with stepped topography,rough surfaces and high stack-up tolerances.DP-P2000 is easy handling and converting process and reusable special property.
特点与优势FEATURES AND BENEFITS
◆ 热传导率可达2.0W/mk
Thermal conductivity 2.0W/mk
◆ 高柔顺性
Highly compliant
◆ 低压力下就有较低的热阻
Low thermal resistance at low pressure
◆ 便于操作,可重复利用
Easy handling and converting process,reusable special property.
典型应用APPLICATIONS
◆ 半导体散热装置
Semiconductors to heat sink
◆ 记忆存储模块
Memory modules
◆ LED 照明设备
LED solid state lighting
◆ 台式电脑,笔记本电脑,网络服务器
Desktop computers,laptops,servers
◆ 通讯设备
Telecommunications equipment
操作说明 HANDLING INFORMATION
该产品具有双面自粘性,如需单面粘性产品,可选择后缀为“-D1”的产品。
Material is standard with both sides tacky; the –D1 suffix indicates only one side is tacky.
产品规格 CONFIGURATIONS AVAILABLE
片状产品(标准尺寸= 400mm*200mm)
Sheet form(Standard size=400mm*200mm)
模切产品 Die-cut parts