PRODUCT DESCRIPTION
LOCTITE® 3542 is a reactive hot-melt adhesive based on
polyurethane prepolymers. The adhesive is pressure sensitive
and provides a high initial strength instantly after joining the
parts. Additionally it has a long open time to be suitable for
automatic or manual assembly line.
TYPICAL PROPERTIES OF UNCURED MATERIAL:
Colour: Transparent when molten,
light ivory after cooling
Odour: Weak
Density:
STM735 1.150.05g/cm3
Solids: 100%
Viscosity:
Brookfield Thermosel,
Spindle 27
4000-7000mPa.s @100degC
Open time1: 2-4 min
Preheating temperature
and time 90 to 100 degC for 20-30 mins
Application Temperature: 90 to 110 degC
1:The bonding range of a 1mm bead of molten adhesive on
substrate. Open time is based on a room temperature
environment. Higher temperature will lengthen the open times
while lower environmental temperatures will shorten the open
times.
TYPICAL PROPERTIES OF CURED MATERIAL:
Coefficient of Thermal Expansion 2 (um/mK.)
STM767 168.2
Thermal Conductivity 2 (W/mK)
STM774 0.318
Specific Heat Capacity 2 (KJ/(Kg.K)), 26C
STM827 2.7
Elongation 3 (%)
STM708 >400
Elastic modulus 3 (MPa)
STM708 >200
Tensile strength 3 (Mpa)
STM708 >8
2: cured for 7 days, curing condition is 24-30C, 50%-70%
3: cured for 9 days, curing condition is 20-25C, 60%-70%
Pretreatment
The bonding surfaces must be clean, dry and free of oil and
grease. Substrate temperature should not fall below 20degC
during application. Lower temperatures will lead to early
solidification of the adhesive and thus to a reduced open time,
possibly the adhesive might even flake off. The substrates
may be preheated if necessary.
Application
LOCTITE® 3542 can be applied from heating cartridge guns,
from usual syringe type melting equipment. At longer rest
periods, melting and application temperatures should be
decreased. Longer exposure to higher temperatures can lead
to a viscosity increase.
Curing
LOCTITE® 3542 cures exclusively by moisture and gains its
final strength in 1-5 days, but exhibits high handling strength
instantly after joining.
Curing is a chemical reaction depending on the following
parameters:
- Humidity in the rooms of application and storage
- Mositure content on the substrates
- Permeability of the substrates to be bonded
- Application volume / layer of the adhesive film