美国UDM AKLC300系列浓缩晶圆切削液

　　l AKLC300洗涤剂浓缩液是一种可生物降解、水性、非碱性、非酸性物质

　　l PV wafer Cleaning after wafering

　　用于切片之后对光伏硅片进行清洗

　　l DI /RO water: Detergent dilution ratio – 1000:1to500 :1

　　去离子水/反渗透水:洗涤剂溶液比例 – 1000:1至500:1

　　l Application temperature:45°C - 70°C

　　使用温度:45°C - 70°C

　　l Excellent wetting, cleaning and rinsing properties

　　极好的湿润、清洁和冲洗功能

　　l Water surface tension reducer

　　降低去离子水/反渗透水表面张力

　　l Completely cleans outSiC (silicon carbide) dust and other contaminants on wafer surfaces

　　可以彻底清洁硅片表面的碳化硅(SiC)尘埃以及其他脏污

　　l Cleans and eliminates Cu (Copper) and Fe (Iron) on PV wafer surfaces after wafering and De-gluing process.

　　在切片以及去胶工序之后彻底清除光伏硅片表面的铜和铁

　　l Biodegradable, non-hazardous and hence easily disposable

　　可生物降解、无危害，可以很容易进行处置

　　l Biochemical Oxygen Demand (BOD) < 2.0 mg/L (BOD less than 2.0 mg/L)

　　生化需氧量(BOD) < 2.0 mg/L (BOD小于2.0 mg/L)

　　l Chemical Oxygen Demand (COD) < 10.0 mg/L (COD less than 10.0 mg/L)

　　化学需氧量(COD) < 10.0 mg/L (COD小于10.0 mg/L)