松下耐高温芯片倒装底填胶CV5300AK01EPS

　　Liquid encapsulant materials

　　CV5300AK

　　TECHNICAL INFORMATION

　　Encapsulation Materials Department Plastic Materials Business Unit Electronic Materials Business Division

　　Panasonic Industory Co., Ltd

　　This is one component epoxy for Flip-chip underfilling.

　　TYPICAL PROPERTIES

　　RECOMMENDING PREHEAT CONDITION

　　temperature of substrate : 80～120oC

　　temperature of syringe : R.T.～ 60oC

　　TYPICAL CURED PROPERTIES

　　Measurement Cure Conditions : 100'C2hour + 150`C 2hour

　　松下耐高温芯片倒装底填胶CV5300AK01EPS

　　・Stored compound must be thawed before use. Warm at room temperature until no longer cool to touch (about 2hrs).

　　・Please use up the material within 12 hrs.

　　・Compound must be stored in the cool condition with sealing.

　　・Please keep material under -40oC after receiving product.

　　ATTENTION TO HANDLING

　　・Please avoid direct contact with this product by wearing gloves, protecting gears,etc.

　　・Prevent frequent skin contact. If contact occurs, wash immediately with soap and water.

　　松下耐高温芯片倒装底填胶CV5300AK01EPS