GL3224-OIY04 USB读卡器控制芯片 创惟原装

　　FEATURE

　　►USB specification compliance

　　- Comply with Universal Serial Bus 3.0 Specification rev. 1.0 (USB 3.0)

　　- Comply with Universal Serial Bus Specification rev. 2.0 (USB 2.0)

　　- Comply with USB Mass Storage Class Specification rev. 1.0

　　- Support USB Mass Storage Class Bulk-Only Transport (BOT)

　　- Support 1 device address and up to 3 endpoints: Control (0) / Bulk Data Read In (1) / Bulk Data Write Out (2)

　　- Support 5 Gbps SuperSpeed, 480 Mbps high-speed, and 12 Mbps full-speed transfer rates

　　►Integrated USB building blocks

　　- USB2.0 transceiver macrocell (UTM), Serial Interface Engine (SIE), embedded Power-On Reset (POR)

　　►Embedded high speed 8051 micro-controller

　　►High efficient DMA hardware engine improves transfer rate between USB and flash card interfaces

　　►Support Ssecure DigitalTM v1.0/ v1.1/ v2.0/ SDHC/ SDXC (Capacity up to 2TB)

　　►Support Secure DigitalTM v3.01 UHS-I (Ultra High Speed): SDR12/ SDR25/ SDR50/ DDR50/ SDR104

　　►Support Secure DigitalTM v5.0

　　►Support MultiMediaCardTM (MMC)

　　- MMC specification v3.x/ v4.0/ v4.1/ v4.2

　　- x1/ x4/ x8 bit data bus

　　►Support Embedded MultiMediaCard TM (e•MMC)

　　- e•MMC specification v4.3/ v4.4/ v4.5/ v5.0

　　- High Speed SDR/ High Speed DDR/ HS200

　　►Support Memory StickTM/ Memory Stick PROTM/ Memory Stick PRO DuoTM/ Memory Stick PRO Duo Mark2TM/ Memory Stick MicroTM (M2)/ Memory Stick PRO-HGTM/ Memory Stick PRO-HG DuoTM/ Memory Stick PRO-HG Duo HXTM

　　- Compliant with Memory Stick Series Specification: MS v1.43, MS PRO v1.05, MS Micro v1.04 (MS HG Micro v1.00), MS PRO-HG Duo 1.03, MS XC Duo v1.00, MS XC-HG Duo v1.00, MS XC Micro v1.00 and MS XC-HG Micro v1.00

　　- Support Read/Write quad data access (512Bytex4) for MS PRO-HG to enhance the transmission rate

　　►Support Serial Peripheral Interface (SPI) for firmware upgrade to SPI Flash Memory via USB interface

　　►Support operation by either MASK ROM or external FW in SPI Flash Memory

　　►On-Chip power MOSFETs for all flash media cards power source

　　►On-chip 5V to 3.3V and 3.3V to 1.2V regulator

　　►On board 25 MHz Crystal driver circuit

　　►Support USB2.0 LPM (Link Power Management)

　　►Support USB3.0 LTM (Latency Tolerance Messaging)

　　►Support USB3.0 U1/U2/U3 low power link state

　　►Pass the USB-IF Test Procedure for SuperSpeed product (TID: 340890039)

　　►Pass WHCK (Windows Hardware Certification Kit) test for Windows 8.1 (Submission ID: 1620543)

　　►Pass WHCK (Windows Hardware Certification Kit) test for Windows 8 (Submission ID: 1620537)

　　►Pass WHQL (Windows Hardware Quality Lab) test for Windows 7 (Submission ID: 1620861)

　　►Support two SD3.0 interfaces with UHS-I: SDR12/ SDR25/ SDR50/ DDR50/ SDR104 bus mode

　　►Support programmable disable MMC interface

　　►Support programmable various LUN (Logic Unit Number): 2 LUNs and 1 LUN

　　►Support programmable SSC (Spread Spectrum Clocking), clock rate in SD, MS memory card interface for better EMI test effect.

　　►Support programmable LED behavior, Read Only option for specific application

　　►Support power-saving mode to disconnect USB bus by card remove for better power management

　　►Support selective-suspend for entering suspend mode when data transfer pending after several seconds.

　　►Support Over-Current protection mechanism

　　►Available in QFN48 pin package (7x7mm) for 2 LUNs: SD3.0/MSPRO-HG and microSD3.0/M2; 1 LUN for e•MMC v4.5/ 8bit data bus/ HS200 mode; with SPI I/F for FW upgrade.

　　►Available in QFN32 pin package (5x5mm), 1 LUN: SD3.0; with SPI I/F for FW upgrade.