台湾智威(zowie)为解决快速发展的大功率快充电源散热及效率的问题，近期推出最新两款桥堆产品LX80M和LXR80M(软桥)，优越的封装: Z4PAK-D，相对其他品牌导热和散热效果更佳显著，已经应用于65W快充市场，得到市场普遍的认可。

　　其他产品均在售，产品广泛用于18W,22.5W,30W,33W,45W快充。普通器桥堆:LX30M(1000V/3A),Z4GP40KLH(4A 800V)Z4GP40MH(1000V/4A),Z4GP60MH(1000V/6A),LS50M(1000V/5A)。

　　软桥:Z4RGP30MPH(1000V/3A),LSR50M(1000V/5A)。

　　ZOWIE LSR50M Z4PAK-S 21+

　　FEATURES

　　Halogen-free type

　　Glass passivation chip

　　Compliance to RoHS product

　　Lead less chip form, no lead damage

　　Low power loss, High efficiency

　　High current capability

　　Plastic package has Underwriters Laboratory Flammability

　　Classification 94V-0

　　APPLICATION

　　AC/DC Power Supply

　　Communication Equipment

　　MECHANICAL DATA

　　Case : Packed with FRP substrate and epoxy underfilled

　　Terminals : Pure Tin plated (Lead-Free),

　　solderable per MIL-STD-750, Method 2026.

　　Polarity : Laser marking symbols