强茂 二极管 GS1010FL

　　FEATURES

　　For surface mounted applications in order to optimize board space

　　Low profile package

　　Ideal for automated placement

　　High temperature soldering : 260°C /10 seconds at terminals

　　Glass passivated chip junction

　　Lead free in compliance with EU RoHS 2.0

　　Green molding compound as per IEC 61249 standard

　　MECHANICAL DATA

　　Case: SOD-123FL, Molded plastic over passivated junction

　　Terminals: Solderable per MIL : STD-750, Method 2026

　　Approx. Weight: 0.0006 ounces, 0.0173 grams

　　Standard Packaging: 8mm tape (EIA- 481)

　　Polarity: Color band denotes cathode end