Capacitive fingerprint module

名称:Capacitive fingerprint module

供应商:北京艾迪沃德科技发展有限公司

价格:面议

最小起订量:0/

地址:北京市海淀区金源时代商务中心A座10A

手机:13718395695

联系人:秦 (请说在中科商务网上看到)

产品编号:77358747

更新时间:2024-11-18

发布者IP:123.119.41.114

详细说明

  The capacitive fingerprint module IDWD1011 is a new type of fingerprint module dedicated to secondary development and integrated applications. It runs fast, has fast identification, and has good stability. IDWD1011 fingerprint module takes ID809/808 high-speed digital processor as the core, combined with a new generation of IDFinget fingerprint recognition algorithm, Swedish FPC1011 semiconductor fingerprint sensor, with fingerprint entry, image processing, feature value extraction, template generation, template storage, fingerprint comparison and search Fingerprint module with other functions; provides UART interface and communication protocol to facilitate user development and integration.

  technical parameter:

project description
Model IDWD1011
CPU ID809/808
Fingerprint sensor FPC1011 dpi:363pixels:200*152
Fingerprint capacity 170/500/1700/3000
False acceptance rate (FAR) <0.001% (security level Security is 3)
Rejection rate (FRR) <0.1% (security level Security is 3)
Comparison method 1:N and 1:1 comparison1:N and 1:1 comparison
Fingerprint template size 1008 bytes
Security level setting Level 1 to Level 5 can be set, the factory setting value: Level 3
Processing speed fingerprint feature extraction time <1
second 1: N comparison time (200 full registration) <0.8 second
Communication interface Communication interface: UART, 3.3V-TTL level
Baud rate Baud rate 9600, 19200, 38400, 57600, 115200 (bps)
Factory setting: 115200bps
Working voltage DC3.3V±10%
Working current <40mA
Working environment Operating temperature: -10℃-60℃
Relative humidity: 20%–80%

  The capacitive fingerprint module IDWD1011 is specially provided for fingerprint door locks, safes, fingerprint U disks, fingerprint keys and other manufacturers to provide standard secondary development fingerprint kits, which is fast and easy to integrate applications.