The MicroLine® series of non-contact critical dimensional measurement systems are ideal for semiconductor and MEMS applications.

　　MicroLine critical dimension measurement systems are designed specifically for semiconductor and MEMs wafer and photomask CD metrology. MicroLine systems automatically measure linewidth, overlay registration, and other critical features.

　　MicroLine Systems are equipped with the highest quality microscope optics and precision motion stages, providing capability to measure features from 0.5 µm to 400 µm in size. Typical measurement accuracy and repeatability is 10 nm at 1 σ (with 100x objective).

　　Standard                                     Optional

　　X,Y,Z Measuring Range (mm):   200x200x25                                300X300x25

　　Z Foucsing Range (mm)     :   25

　　Max Recommanded Load      :   2kg

　　Measurement Accuracy in the field of view:0.010um (with 100x objective lens)